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Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges. The FINEPLACER® systems are designed to be modular for maximum process flexibility and come in manual, semi-automatic or automatic configurations.
Our versatile bonders are ideal for R&D, lab, and prototype environments. We also have automated systems for high-mix and/or more fully-automated production with higher volumes. Research departments of major OEMs, military, and government-funded labs, along with academic institutions are all avid users of Finetech systems. Finetech bonders support the most precise and complex applications: flip chip, laser bars, photonics packaging, VCSELs, MEMS, sensors, Chip-to-wafer, and much more.
The company services customers in a broad range of industries including aerospace, medical technology, consumer electronics, semiconductor, optoelectronics, military, universities and research. With installations across worldwide, Finetech works with companies from the start-up phase to large multi-national corporations.
Corporate offices and main production are in Berlin and in addition we employ over 160 committed and highly qualified staff in Dresden and Weßling. Sales and Technical support centers are located in Gilbert, Arizona; Manchester, New Hampshire; Shanghai, China; Penang, Malaysia and Tokyo, Japan.
To strengthen our Berlin team we are currently looking for a
Workplace: Berlin
Interested? Please send your comprehensive application as PDF file to our personnel consultant Ms. Eva-Maria Groth by clicking "Apply now". She will be happy to assist you with any further questions at +49 (0) 33632 59 83 80 or +49 (0) 160 2395 112.
emg Personalberatung, Eva-Maria Groth, Pettenkoferstr. 16, 10247 Berlin